Inseto has supported Transense Technologies in the scale up of its SAWsense sensor manufacturing capability through the supply and installation of a bespoke high precision die bonding platform.
The system has been implemented to support the transition of SAWsense from advanced process development into scalable, repeatable manufacturing. SAWsense technology is based on patented Surface Acoustic Wave sensing and is used to measure torque, force and temperature in demanding environments including aerospace, automotive, robotics, electric drivetrains and motorsport.
The acquisition followed an 18-month development programme, including trials at Newcastle University's Driving the Electric Revolution Industrialisation Centre (DER-IC) to define a production-ready process.
Commenting on the project, Ryan Maughan, Managing Director at Transense Technologies, said: "Inseto's support was a key part of delivering this project successfully. From equipment selection through to installation and commissioning, the team worked closely with us to ensure the platform met the precision, flexibility and scalability we required. Their application knowledge and hands on support gave us confidence that the system will underpin our manufacturing roadmap as SAWsense moves into high volume production."
Inseto has extensive experience supporting advanced packaging and sensor manufacturing across the UK, Ireland and Nordics, working with customers to deliver equipment, process expertise and local support for demanding production and research environments.