Emerson highlights Branson GSX-E1 ultrasonic welder at PACK EXPO

Controls automatically monitor critical weld parameters in real time, delivering actionable performance and diagnostic data to help determine OEE (overall equipment effectiveness), enable traceability and optimize maintenance.

The welder's encryption technology ensures data integrity and security. Compared to joining techniques like heat sealing, adhesives or mechanical fasteners, ultrasonic welders like the Branson GSX-E1 use less electricity, require no consumable materials and yield less waste, cutting assembly-line carbon.

Emerson will also exhibit its latest Floor to Cloud packaging solutions. Advancing the boundless future of automation, Emerson factory automation solutions and its Floor to Cloud approach empower smarter packaging lines and more efficient processes that make it possible for manufacturers to continuously improve plant productivity, sustainability and safety.

Packaging automation experts will demonstrate how a Floor to Cloud approach unlocks trapped data and connects islands of automation, giving manufacturers the visibility and control to solve critical challenges and ambitious goals.

Attendees will learn how to accelerate net zero progress, raise overall equipment effectiveness (OEE) asset by asset, and empower teams with data to drive continuous improvement across the factory floor.

In addition to showcasing its packaging automation solutions, Emerson will also sponsor two events, the annual Packaging and Processing Women's Leadership Network (PPWLN) breakfast and the Amazing Packaging Race.

As part of the Amazing Packaging Race, teams from US colleges, trade schools and universities race to complete tasks and solve problems at booths across the PACK EXPO show floor.