Posted to News on 19th Jan 2026, 10:35
Electrically insulating epoxy features ultra-high thermal conductivity
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical.
Featuring the highest thermal conductivity in the Master Bond electrically insulating portfolio - exceeding 6 W/(mK) - it delivers exceptional heat dissipation while remaining electrically non-conductive and compliant with ASTM E595 NASA low outgassing requirements.
Formulated with a specialty filler featuring a particle size range of 5-30 microns, EP54TC supports thin bond lines and efficient void filling to maximize thermal performance. It offers an exceptionally low thermal resistance of 5-7 10-6 Km2/W and a high tensile modulus exceeding 1,000,000 psi at room temperature. This robust system is serviceable from -73degC to +204degC) and, when post-cured, achieves a glass transition temperature of 70-80degC and a Shore D hardness of 85-95.
EP54TC is a moderate heat cured system, with a recommended schedule of 2 hours at 80degC followed by a 2-4 hour post cure at 90-125degC. The mixed material features a viscosity of 100,000-200,000 cps and offers a manageable working life of 60-90 minutes at ambient temperature. To accommodate both research and large-scale manufacturing, EP54TC is available for purchase in ounce, half-pint, pint, quart and gallon kits.
